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Power semiconductor 

型号输出电路组数负载电流

输出电压

外型尺寸

封装形式
JGW-5396M一组常开0.1A/0.2A±370V

4.7x6.45x2.7

CSOP6封装，熔焊密封
JGW-5384M一组常开0.1A/0.2A±55V

4.7x6.45x2.7

CSOP6封装，熔焊密封
JGW-5385M一组常开0.8/1.6A±90V

4.7x6.45x2.7

CSOP6封装，熔焊密封
JGW-5397M两组常开0.1A±370V

6x6.45x2.7

CSOP8封装，熔焊密封
JGW-5386M两组常开0.3A±90V

6x6.45x2.7

CSOP8封装，熔焊密封
JGW-5387M两组常开0.8A55V

6x6.45x2.7

CSOP8封装，熔焊密封
JGW-5398M四组常开0.1A±370V

10.7x6.45x2.7

CSOP16封装，熔焊密封
JGC-5379M四组常开0.3A±90V

10.7x6.45x2.7

CSOP16封装，熔焊密封
JGC-3037M四组常开0.3A±90V

10.7x6.45x2.7

CSOP16封装，熔焊密封
JGW-5388M四组常开0.6A55V

10.7x6.45x2.7

CSOP16封装，熔焊密封
了解更多 →
型号输出电路组数负载电流

输出电压

外型尺寸

封装形式
JGW-5220M一组常开0.3A±55V

5.2x7.6x4.2

5.2x7.6x3.2

DIP4、SMD4、LCC4封装，熔焊密封
JGW-5215MA一组常开0.2/0.4A±370V

8.6x7.6x4.2

DIP6、SMD6封装，熔焊密封
JGW-5190MA一组常开0.2/0.4A±370V

9.91x7.6x4.2

DIP8、SMD8封装，熔焊密封
JGW-5215MB一组常开0.4/0.8A±190V

8.6x7.6x4.2

DIP6、SMD6封装，熔焊密封
JGW-5271M一组常开0.7A±190V

10x10x4

表面贴焊封装，熔焊密封
JGW-3M一组常开0.8/1.6A±90V

9.91x7.6x4.2

DIP8、SMD8封装，熔焊密封
JGW-3MD一组常开0.8/1.6A±90V

9.91x7.6x4.2

DIP8、SMD8、LCC8封装，熔焊密封
JGW-5215M一组常开1.0/2.0A±55V

8.6x7.6x4.2

DIP6、SMD6封装，熔焊密封
JGW-5190M一组常开1.0/2.0A±55V

9.91x7.6x4.2

DIP8、SMD8封装，熔焊密封
JGW-5190MD一组常开1.0/2.0A±90V

9.91x7.6x4.2

DIP8、SMD8封装，熔焊密封
JGW-5215MC一组常开2.5A/5.0A±90V

8.6x7.6x4.2

DIP6、SMD6封装，熔焊密封
JGW-3MB一组常开2.5A/5.0A±90V

9.91x7.6x4.2

DIP8、SMD8封装，熔焊密封
JGW-5315M一组常开5.0A±75V

10x10x4

表面贴焊封装，熔焊密封
JGC-5248M一组常开8.0A±60V

20.5x10.5x5.5

LCC封装，熔焊密封
JGW-5219MA两组常开0.1A±370V

9.91x7.6x4.2

DIP8、SMD8封装，熔焊密封
JGW-5219M两组常开0.5 A±55V

9.91x7.6x4.2

DIP8、SMD8封装，熔焊密封
JGW-5219MB两组常开2A±90V

9.91x7.6x4.2

DIP、SMD8封装，熔焊密封
JGC-5216MA四组常开0.1A±370V24x7.6x4.2DIP16封装，熔焊密封
JGC-5216M四组常开0.3A±55V24x7.6x4.2DIP16封装，熔焊密封
JGC-5216MB四组常开0.5A±55V24x7.6x4.2DIP16封装，熔焊密封
JGC-5240M四组常开0.5A±90V

20.5x7.6x4.2

20.5x7.6x3.2

DIP16、LCC16封装，熔焊密封
JGC-5240MA四组常开2A±90V

20.5x7.6x4.2

20.5x7.6x3.2

DIP16、LCC16封装，熔焊密封
JGW-5220MA一组常闭0.2A±55V

5.2x7.6x4.2

5.2x7.6x3.2

DIP4、SMD4、LCC4封装，熔焊密封
JGW-5190MB一组常闭0.15/0.3A±220V9.91x7.6x4.2DIP8、SMD8 封装，熔焊密封
JGW-5296M两组常闭0.3A±60V9.91x7.6x4.2DIP8、SMD8 封装，熔焊密封
JGC-5267M四组常闭0.2A±55V

20.5x7.6x4.2

20.5x7.6x3.2

DIP16封装、LCC16封装，熔焊密封
JGW-5257M一组转换0.1A±370V9.91x7.6x4.2DIP8、SMD8封装，熔焊密封
JGW-5258M一组转换0.3A±55V9.91x7.6x4.2DIP8、SMD8封装，熔焊密封
JGC-5259M两组转换0.1A±370V

20.5x7.6x4.2

20.5x7.6x3.2

DIP16 、LCC16封装，熔焊密封
JGC-5260M两组转换0.2A±55V

20.5x7.6x4.2

20.5x7.6x3.2

DIP16 、LCC16封装，熔焊密封
了解更多 →
型号输出电路组数负载电流

输出电压

外型尺寸

封装形式
JGX-5174F一组常开（磁隔离）150A135Vd.c.

86.5x66.5x34

灌封
JGX-1931FCA一组常开（磁隔离）160A60Vd.c.

86.5x66.5x34

灌封
JG-88M一组常开（磁隔离）200A60Vd.c.

80.5x66x21.5

熔焊密封
JGX-5070F一组常开（磁隔离）250A60Vd.c.

86.5x66.5x34

灌封
了解更多 →